Tata Electronics and Japan’s ROHM Join Forces to Build India’s Semiconductor Ecosystem.

Tata Electronics has entered into a strategic partnership with Japanese semiconductor leader ROHM Co. to establish a robust manufacturing framework for power semiconductors in India. The collaboration aims to serve both the rapidly growing Indian market and global export demands, further cementing India’s position as an emerging semiconductor hub.

As part of the initial phase, Tata Electronics will provide advanced assembly and testing services for ROHM’s India-designed automotive-grade Si MOSFETs. These high-efficiency power components are essential for electric vehicles (EVs) and modern automotive electronics, with mass production shipments targeted to begin by 2026.

Building a Geo-Resilient Supply Chain

The partnership is designed to combine ROHM’s world-class device technology and design expertise with Tata Electronics’ backend manufacturing capabilities. This move aligns with the "Make in India" initiative, focusing on "Designed in India, Manufactured in India" solutions to ensure a stable, region-based supply chain.

"This partnership will go a long way in bringing trust and resilience to the global semiconductor supply chain while expanding our respective business opportunities," said Dr. Randhir Thakur, CEO & MD of Tata Electronics.

A Growing Ecosystem: From Intel to ROHM

The deal with ROHM follows a string of high-profile alliances for Tata Electronics. Earlier this month, the company signed a similar agreement with Intel to explore the manufacturing and packaging of Intel products, including AI PC solutions, for local markets.

To support these ambitious projects, Tata Electronics is currently investing nearly $14 billion across two flagship facilities:

Dholera, Gujarat: India's first commercial semiconductor Fab, built in partnership with PSMC (Taiwan).

Jagiroad, Assam: India's first indigenous Outsourced Semiconductor Assembly and Test (OSAT) facility.

The Assam unit is expected to begin initial operations by mid-2026, providing the critical infrastructure needed to package and test the chips developed through these global partnerships.